OSAKA — Nippon Electric Glass will ship samples as early as 2026 of large glass substrates it is developing for high-performance semiconductor devices, hoping that the material’s heat resistance will spur chipmakers to choose it over conventional plastic.
The Japanese company will ship samples of large square glass substrates about 510 millimeters long — one size up from its current 300-mm products. It will embark on mass-producing the larger size once demand is confirmed. It also plans to put 600-mm substrates into practical use by 2028.
